{"id":6062,"date":"2025-09-30T15:34:13","date_gmt":"2025-09-30T07:34:13","guid":{"rendered":"https:\/\/www.ukm.my\/imen\/?page_id=6062"},"modified":"2025-11-10T21:06:40","modified_gmt":"2025-11-10T13:06:40","slug":"cleanroom","status":"publish","type":"page","link":"https:\/\/www.ukm.my\/imen\/cleanroom\/","title":{"rendered":"Cleanroom Lab."},"content":{"rendered":"\t\t
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CLEANROOM LAB.<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t
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  • Our MEMS Fabrication Laboratory supports the design, fabrication, and characterization of Micro-Electro-Mechanical Systems (MEMS) devices. These micro-devices are created from silicon and similar materials using advanced micromachining processes derived from semiconductor fabrication technology.<\/span><\/p>

    The facility features a dedicated cleanroom environment essential for high-precision fabrication.<\/p>

    • Total Cleanroom Area<\/b>: 180 m\u00b2<\/p><\/li>

    • Class 100 Zone<\/b>: A 40 m\u00b2 yellow-light area specifically designed for critical processes like photolithography<\/b> and wafer bonding<\/b>.<\/p><\/li>

    • Class 1000 Zone<\/b>: A 140 m\u00b2 space for other fabrication and characterization activities.<\/p><\/li><\/ul>

      Originally built in 1995, the cleanroom was significantly upgraded in 2002 to house additional state-of-the-art equipment for MEMS research and development.<\/p><\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t

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      Head of Laboratory<\/h2>

      Prof. Dato'. Dr. Burhanuddin Yeop Majlis<\/h3>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t

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      PIC Laboratory<\/h2>

      Anezah Marsan<\/h3>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t

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      PIC Laboratory<\/h2>

      Mohd Faizal Aziz<\/h3>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t

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      EQUIPMENT \/ FACILITIES<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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      JEOL SCANNING ELECTRON MICROSCOPE <\/div><\/span>\n\t\t\t\t\t\t\t\t\t<\/summary>\n\t\t\t\t
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      • A scanning electron microscope for fast characterization and high-resolution imaging of a wide variety of sample types.\u00a0<\/p>

        • How It Works \/ Principle<\/b> It uses a highly focused beam of electrons to scan a sample’s surface. By detecting the scattered or emitted electrons and X-rays, it creates a detailed image and can analyze the sample’s composition.<\/p><\/li>

        • Key Features & Advantages<\/b><\/p>

          • Magnification:<\/b> 5x to 300,000x<\/p><\/li>

          • High-Voltage Resolution:<\/b> Up to 3.0 nm<\/p><\/li>

          • Max Sample Size:<\/b> 150 mm diameter<\/p><\/li>

          • Low Vacuum Mode:<\/b> Allows for observation of non-conductive samples without coating.<\/p><\/li><\/ul><\/li>

          • Applications<\/b> Imaging fine features of integrated circuits (ICs) and monitoring the quality of thin films, photoresist patterns, and etching processes at the nanoscale.<\/p><\/li><\/ul><\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t\t

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            THIN FILM MAPPING <\/div><\/span>\n\t\t\t\t\t\t\t\t\t<\/summary>\n\t\t\t\t
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            An advanced spectral reflectance system that maps thin-film thickness quickly and easily.<\/p>

            • How It Works \/ Principle<\/b> It works on the principle of spectral reflectance (thin-film interference), measuring how light reflects off a thin film to determine its thickness and optical properties (n and k) without touching the sample.<\/p><\/li>

            • Model : <\/b>Filmetrics F50-2000<\/p><\/li>

            • Key Features & Advantages<\/b><\/p>

              • Automated Stage:<\/b> Automatically moves to selected measurement points.<\/p><\/li>

              • High-Speed Measurement:<\/b> Provides thickness readings in seconds.<\/p><\/li>

              • Flexible Map Patterns:<\/b> Can create detailed maps of thickness uniformity across a wafer.<\/p><\/li><\/ul><\/li>

              • Applications<\/b> Measures the thickness and refractive index of films like SiO2<\/span>, Si3N4<\/span>, polysilicon, and photoresist. Essential for monitoring deposition and etching processes.<\/p><\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t\t

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                PLASMA-ENHANCED CHEMICAL VAPOR DEPOSITION (PECVD) <\/div><\/span>\n\t\t\t\t\t\t\t\t\t<\/summary>\n\t\t\t\t
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                A deposition system used to create ultra-thin films with incredible precision for applications in materials science and beyond.<\/p>

                • How It Works \/ Principle<\/b> PECVD uses plasma energy to decompose precursor gases into reactive species, which then deposit onto a substrate as a thin film.<\/p><\/li>

                • Key Features & Advantages<\/b><\/p>

                  • Low-Temperature Deposition:<\/b> Its primary advantage is the ability to deposit high-quality thin films at significantly lower temperatures by using plasma instead of high thermal energy.<\/p><\/li><\/ul><\/li>

                  • Applications<\/b> Creating thin films for advanced materials, microelectronics, and semiconductors.<\/p><\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t\t

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                    DC\/RF MAGNETRON SPUTTER <\/div><\/span>\n\t\t\t\t\t\t\t\t\t<\/summary>\n\t\t\t\t
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                    A versatile deposition system that creates high-quality thin films with excellent adhesion using precise DC\/RF sputtering control.<\/p>

                    • How It Works \/ Principle<\/b> The system utilizes two sputtering techniques, RF (Radio Frequency) and DC (Direct Current) sputtering, within the same chamber to deposit material onto a substrate.<\/p><\/li>

                    • Key Features & Advantages<\/b><\/p>

                      • Dual-Mode Operation:<\/b> Combines both DC and RF sputtering for maximum flexibility.<\/p><\/li>

                      • High-Quality Films:<\/b> Offers precise control for versatile deposition, producing films with excellent adhesion.<\/p><\/li><\/ul><\/li>

                      • Applications<\/b> Creating thin films for advanced materials, electronics, and semiconductor applications.<\/p><\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t\t

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                        GOLD SPUTTER COATER <\/div><\/span>\n\t\t\t\t\t\t\t\t\t<\/summary>\n\t\t\t\t
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                        A Q150RS sputter coater used to apply a thin, electrically conductive gold film onto samples for Scanning Electron Microscopy (SEM).<\/p>

                        • How It Works \/ Principle<\/b> It uses magnetron sputter deposition to apply a conductive layer of gold onto non-conductive samples. This film prevents specimen ‘charging’, reduces thermal damage, and enhances secondary electron emission for clearer imaging in an SEM.<\/p><\/li>

                        • Key Features & Advantages<\/b>
                          • Automated Control:<\/b> Features a fully automatic touch-and-swipe capacitive color screen for easy operation.<\/p><\/li>

                          • Optimized for SEM:<\/b> Specifically designed to prepare samples for high-resolution imaging.<\/p><\/li><\/ul><\/li>

                          • Applications<\/b> General-purpose thin film coating of gold (Au) for SEM sample preparation.<\/p><\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t\t

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                            A high-temperature furnace used for thermal oxidation, annealing, and diffusion drive-in processes in semiconductor fabrication.<\/p>

                            • How It Works \/ Principle<\/b> The furnace exposes a silicon wafer to an oxidizing agent (like oxygen or water vapor) in a precisely controlled high-heat environment (up to 1000\u00b0C) to grow a uniform layer of silicon dioxide (S<\/span>i<\/span>O<\/span>2<\/span><\/span><\/span><\/span>\u200b<\/span><\/span><\/span><\/span><\/span><\/span><\/span><\/span><\/span>).<\/p><\/li>

                            • Key Features & Advantages<\/b><\/p>

                              • High-Purity Processing:<\/b> Designed to achieve ultra-precise control over temperature, atmosphere, and cleanliness.<\/p><\/li>

                              • Uniform Growth:<\/b> Ensures a uniform, high-quality silicon dioxide layer across the wafer.<\/p><\/li><\/ul><\/li>

                              • Applications<\/b> Performing dry oxidation processes and high-temperature annealing of wafers.<\/p><\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t\t

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                                REACTIVE ION ETCHING <\/div><\/span>\n\t\t\t\t\t\t\t\t\t<\/summary>\n\t\t\t\t
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                                An advanced etching system used to create high-precision patterns and structures in microfabrication.<\/p>

                                • How It Works \/ Principle<\/b> The process takes place in a vacuum chamber where a plasma is generated. A combination of chemical reaction and physical ion bombardment removes material from the wafer surface.<\/p><\/li>

                                • Key Features & Advantages<\/b><\/p>

                                  • Anisotropic Etching:<\/b> Produces highly directional etching, allowing for the creation of vertical sidewalls and high-aspect-ratio structures.<\/p><\/li><\/ul><\/li>

                                  • Applications<\/b> Etching thin films for advanced materials, microelectronics, and semiconductors.<\/p><\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t\t

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                                    KARL-SUSS MJB MASK ALIGNER (MJB 3) <\/div><\/span>\n\t\t\t\t\t\t\t\t\t<\/summary>\n\t\t\t\t
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                                    A high-resolution contact mask aligner designed for laboratory and development environments.<\/p>

                                    • How It Works \/ Principle<\/b> It performs high-precision 1:1 contact printing, transferring a pattern from a mask onto a substrate (like a silicon wafer) coated with photoresist.<\/p><\/li>

                                    • Key Features & Advantages<\/b><\/p>

                                      • High Resolution:<\/b> Designed for high-resolution photolithography applications.<\/p><\/li>

                                      • Substrate Flexibility:<\/b> Accommodates standard wafers up to 3 inches and non-standard, irregularly shaped substrates.<\/p><\/li><\/ul><\/li>

                                      • Applications<\/b> High-resolution photolithography for R&D and pilot production.<\/p><\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t\t

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                                        MIDAS SINGLE SIDE MASK ALIGNER (MDA-400LJ) <\/div><\/span>\n\t\t\t\t\t\t\t\t\t<\/summary>\n\t\t\t\t
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                                        A mask aligner designed to provide precise alignment and exposure of photomasks onto substrates for creating intricate microscopic patterns.<\/p>