{"id":6062,"date":"2025-09-30T15:34:13","date_gmt":"2025-09-30T07:34:13","guid":{"rendered":"https:\/\/www.ukm.my\/imen\/?page_id=6062"},"modified":"2025-11-10T21:06:40","modified_gmt":"2025-11-10T13:06:40","slug":"cleanroom","status":"publish","type":"page","link":"https:\/\/www.ukm.my\/imen\/cleanroom\/","title":{"rendered":"Cleanroom Lab."},"content":{"rendered":"\t\t
\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\tOur MEMS Fabrication Laboratory supports the design, fabrication, and characterization of Micro-Electro-Mechanical Systems (MEMS) devices. These micro-devices are created from silicon and similar materials using advanced micromachining processes derived from semiconductor fabrication technology.<\/span><\/p> The facility features a dedicated cleanroom environment essential for high-precision fabrication.<\/p> Total Cleanroom Area<\/b>: 180 m\u00b2<\/p><\/li> Class 100 Zone<\/b>: A 40 m\u00b2 yellow-light area specifically designed for critical processes like photolithography<\/b> and wafer bonding<\/b>.<\/p><\/li> Class 1000 Zone<\/b>: A 140 m\u00b2 space for other fabrication and characterization activities.<\/p><\/li><\/ul> Originally built in 1995, the cleanroom was significantly upgraded in 2002 to house additional state-of-the-art equipment for MEMS research and development.<\/p><\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t \nburhan@ukm.edu.my<\/p>\n\t\t\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t anezahmarsan@ukm.edu.my<\/p>\n\t\t\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t faizal_imen@ukm.edu.my<\/p>\n\t\t\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t A scanning electron microscope for fast characterization and high-resolution imaging of a wide variety of sample types.\u00a0<\/p> How It Works \/ Principle<\/b> It uses a highly focused beam of electrons to scan a sample’s surface. By detecting the scattered or emitted electrons and X-rays, it creates a detailed image and can analyze the sample’s composition.<\/p><\/li> Key Features & Advantages<\/b><\/p> Magnification:<\/b> 5x to 300,000x<\/p><\/li> High-Voltage Resolution:<\/b> Up to 3.0 nm<\/p><\/li> Max Sample Size:<\/b> 150 mm diameter<\/p><\/li> Low Vacuum Mode:<\/b> Allows for observation of non-conductive samples without coating.<\/p><\/li><\/ul><\/li> Applications<\/b> Imaging fine features of integrated circuits (ICs) and monitoring the quality of thin films, photoresist patterns, and etching processes at the nanoscale.<\/p><\/li><\/ul><\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t\t An advanced spectral reflectance system that maps thin-film thickness quickly and easily.<\/p> How It Works \/ Principle<\/b> It works on the principle of spectral reflectance (thin-film interference), measuring how light reflects off a thin film to determine its thickness and optical properties (n and k) without touching the sample.<\/p><\/li> Model : <\/b>Filmetrics F50-2000<\/p><\/li> Key Features & Advantages<\/b><\/p> Automated Stage:<\/b> Automatically moves to selected measurement points.<\/p><\/li> High-Speed Measurement:<\/b> Provides thickness readings in seconds.<\/p><\/li> Flexible Map Patterns:<\/b> Can create detailed maps of thickness uniformity across a wafer.<\/p><\/li><\/ul><\/li> Applications<\/b> Measures the thickness and refractive index of films like SiO2<\/span>, Si3N4<\/span>, polysilicon, and photoresist. Essential for monitoring deposition and etching processes.<\/p><\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t\t A deposition system used to create ultra-thin films with incredible precision for applications in materials science and beyond.<\/p> How It Works \/ Principle<\/b> PECVD uses plasma energy to decompose precursor gases into reactive species, which then deposit onto a substrate as a thin film.<\/p><\/li> Key Features & Advantages<\/b><\/p> Low-Temperature Deposition:<\/b> Its primary advantage is the ability to deposit high-quality thin films at significantly lower temperatures by using plasma instead of high thermal energy.<\/p><\/li><\/ul><\/li> Applications<\/b> Creating thin films for advanced materials, microelectronics, and semiconductors.<\/p><\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t\t A versatile deposition system that creates high-quality thin films with excellent adhesion using precise DC\/RF sputtering control.<\/p> How It Works \/ Principle<\/b> The system utilizes two sputtering techniques, RF (Radio Frequency) and DC (Direct Current) sputtering, within the same chamber to deposit material onto a substrate.<\/p><\/li> Key Features & Advantages<\/b><\/p> Dual-Mode Operation:<\/b> Combines both DC and RF sputtering for maximum flexibility.<\/p><\/li> High-Quality Films:<\/b> Offers precise control for versatile deposition, producing films with excellent adhesion.<\/p><\/li><\/ul><\/li> Applications<\/b> Creating thin films for advanced materials, electronics, and semiconductor applications.<\/p><\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t\t A Q150RS sputter coater used to apply a thin, electrically conductive gold film onto samples for Scanning Electron Microscopy (SEM).<\/p> How It Works \/ Principle<\/b> It uses magnetron sputter deposition to apply a conductive layer of gold onto non-conductive samples. This film prevents specimen ‘charging’, reduces thermal damage, and enhances secondary electron emission for clearer imaging in an SEM.<\/p><\/li> Automated Control:<\/b> Features a fully automatic touch-and-swipe capacitive color screen for easy operation.<\/p><\/li> Optimized for SEM:<\/b> Specifically designed to prepare samples for high-resolution imaging.<\/p><\/li><\/ul><\/li> Applications<\/b> General-purpose thin film coating of gold (Au) for SEM sample preparation.<\/p><\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t\t A high-temperature furnace used for thermal oxidation, annealing, and diffusion drive-in processes in semiconductor fabrication.<\/p> How It Works \/ Principle<\/b> The furnace exposes a silicon wafer to an oxidizing agent (like oxygen or water vapor) in a precisely controlled high-heat environment (up to 1000\u00b0C) to grow a uniform layer of silicon dioxide (S<\/span>i<\/span>O<\/span>2<\/span><\/span><\/span><\/span>\u200b<\/span><\/span><\/span><\/span><\/span><\/span><\/span><\/span><\/span>).<\/p><\/li> Key Features & Advantages<\/b><\/p> High-Purity Processing:<\/b> Designed to achieve ultra-precise control over temperature, atmosphere, and cleanliness.<\/p><\/li> Uniform Growth:<\/b> Ensures a uniform, high-quality silicon dioxide layer across the wafer.<\/p><\/li><\/ul><\/li> Applications<\/b> Performing dry oxidation processes and high-temperature annealing of wafers.<\/p><\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t\t
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Prof. Dato'. Dr. Burhanuddin Yeop Majlis<\/h3>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t
\n\t\t\t\t\t\t\t\t\t<\/figure>\n\t\t\t\t\n\t\t\t\t\n\t\t\t<\/div>\n\n\t\t\tPIC Laboratory<\/h2>
Anezah Marsan<\/h3>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t
\n\t\t\t\t\t\t\t\t\t<\/figure>\n\t\t\t\t\n\t\t\t\t\n\t\t\t<\/div>\n\n\t\t\tPIC Laboratory<\/h2>
Mohd Faizal Aziz<\/h3>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t
EQUIPMENT \/ FACILITIES<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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