{"id":2505,"date":"2018-11-05T04:27:35","date_gmt":"2018-11-05T04:27:35","guid":{"rendered":"https:\/\/www.ukm.my\/imen\/?page_id=2505"},"modified":"2020-07-06T03:51:22","modified_gmt":"2020-07-06T03:51:22","slug":"dr-maria-abu-bakar","status":"publish","type":"page","link":"https:\/\/www.ukm.my\/imen\/research-fellows\/dr-maria-abu-bakar\/","title":{"rendered":"Dr. Maria Abu Bakar"},"content":{"rendered":"

\"\"<\/a><\/p>\n

Senior Lecturer \/ Research Fellow<\/em><\/p>\n

Phone: 03-89216984
\nEmail: maria@ukm.edu.my
\nORCID ID: 0000-0002-9745-3334
\nGoogle Scholar Profile<\/a>
\n<\/a>SCOPUS Profile<\/a><\/p>\n

 <\/p>\n

EDUCATIONAL QUALIFICATIONS<\/p>\n

2007 Bachelor of Science, 2007, Materials Science, 集美麻豆, Malaysia
\n2013 Master of Science, Materials Science, 集美麻豆 Malaysia
\n2017 Doctor of Philosophy, IMEN-UKM Malaysia<\/p>\n

 <\/p>\n

RESEARCH AREA:<\/p>\n

1. Materials Science
\n2. Electronic Packaging
\n3. Microstructure-properties-performance-materials relationship<\/p>\n

 <\/p>\n

RESEARCH HIGHLIGHT:<\/p>\n

\"\"<\/a> \"\"<\/a>Research on interconnection materials such as solder joint including fine-pitch solder joint and wire bonding.<\/p>\n

RESEARCH EXPERIENCES:<\/p>\n

2008-2012: Graduate Research Assistance (GRA), School of Applied Physics,
\nFaculty of Science and Technology, 集美麻豆 Bangi, 2008-2012.
\n2013-2017: Graduate Research Assistance (GRA), Institute of
\nMicroengineering and Nanoelectronics (IMEN), 集美麻豆
\n2017-2018: Post-doctoral researcher, Institute of Microengineering and
\nNanoelectronics (IMEN), 集美麻豆 Bangi<\/p>\n

 <\/p>\n

AWARDS:<\/p>\n

1. Best Poster Award, the Electronic Packaging Interconnect Technology
\nSymposium (EPITS), 21 November 2015, Pulau Pinang.
\n2. Bronze Award for innovation \u201cMechanical Properties of Microelectronic
\nPackage for Military Device Applications\u201d, 10-11 Julai 2017, Kuala Lumpur.<\/p>\n

 <\/p>\n

SELECTED PUBLICATIONS:<\/p>\n

    \n
  1. \u00a0Maria Abu Bakar, Azman Jalar, Roslina Ismail. 2018. Kesan kemasan\u00a0permukaan berbeza terhadap sifat mikromekanik sambungan pateri SAC 0307\u00a0\u00a0menggunakan pendekatan pelekukan nano (Effect of different surface finishes on micromechanical properties of SAC 0307 solder joint using nanoindentation approach). Sains Malaysiana 47(5)(2018): 1011\u20131016. ISI Q3. IF (2017): 0.565.<\/li>\n
  2. Maria Abu Bakar, Azman Jalar, Roslina Ismail. 2018. Penilaian semula\u00a0pengukuran kuantitatif stereometri terhadap pertumbuhan sebatian antara logam bagi sambungan pateri (Reassessment of stereometric quantitative\u00a0\u00a0measurements on the growth of intermetallic compound for solder\u00a0connections). Sains Malaysiana 47(4)(2018): 805-810. ISI Q3. IF (2017): 0.565.<\/li>\n
  3. Azman Jalar, Maria Abu Bakar, Roslina Ismail, Najib Saedi Ibrahim, Mohd\u00a0Ariffin Ambak. 2018. Kesan pigment pewarna terhadap pertumbuhan sebatian antara logam sambungan pateri Sn-3.0Ag-0.5Cu (Effect of coloured pigment on intermetallic compound growth of Sn-3.0Ag-0.5Cu solder joint). Sains\u00a0Malaysiana 47(4)(2018): 1005-1010. ISI Q3. IF (2017): 0.565.<\/li>\n
  4. Norliza Ismail, Azman Jalar, Maria Abu Bakar & Roslina Ismail. Effect of\u00a0carbon nanotube addition on the growth of intermetallic layer of Sn-Ag-Cu solder system under thermal aging (Kesan penambahan tiubnano karbon terhadap pertumbuhan lapisan sebatian antara logam sistem pateri Sn-Ag- Cu\/Cu akibat penuaan terma). Sains Malaysiana 47(7)2018: 1585-1590. ISI Q3. IF (2017): 0.565.<\/li>\n
  5. Maria Abu Bakar, Azman Jalar, Mohd Zulkifly Abdullah, Najib Saedi Ibrahim & Mohd Ariffin Ambak. Pengawalan pertumbuhan sebatian antara logam sambungan pateri-papan litar bercetak menggunakan salutan nikel (Controlling of intermetallic compound solder interconnection-printed\u00a0circuit board using nickel coating). Accepted to be published in Sains\u00a0\u00a0Malaysiana. ISI Q3. IF (2017): 0.565.<\/li>\n
  6. Wilfred Paulus, Irman Abdul Rahman, Azman Jalar, Norinsan Kamil Othman, Roslina Ismail, Wan Yusmawati Wan Yusoff & Maria Abu Bakar. 2017. The Relationship between XRD Peak Intensity and Mechanical Properties of Irradiated Lead-Free Solder. Materials Science Forum 888: 423-427.<\/li>\n
  7. Azman Jalar, Maria Abu Bakar, Roslina Ismail, Abdul Razak Daud. 2016.\u00a0Statistical aspect on the measuring of intermetallic compound thickness of \u00a0lead free solders. Journal of Scientific Research and Development 3 (4): 49-54. IF: 1.69.<\/li>\n
  8. Maria Abu Bakar, Azman Jalar, Abdul Razak Daud, Roslina Ismail, Najib\u00a0Saedi Ibrahim. 2016. Micromechanical properties of solder joint\u00a0Sn3.0Ag0.5Cu on Electroless Nickel immersion gold (ENIG) using Nanoindentation approach. International Journal of Advanced and Applied Sciences, 3(2): 1\u20105. IF: 0.601.<\/li>\n
  9. Maria Abu Bakar, Azman Jalar, Abdul Razak Daud, Roslina Ismail, Nur\u00a0Azida Che Lah & Najib Saedi Ibrahim. 2016. Nanoindentation Approach on\u00a0Investigating Micromechanical Properties of Joining from Green Solder Materials (Kaedah Perlekukan Nano dalam Mengkaji Sifat Mikromekanik Sambungan Bahan Aloi Pateri Hijau). Sains Malaysiana 45(8): 1275\u20131279. IF
    \n(2016): 0.470.<\/li>\n
  10. Maria Abu Bakar, Azman Jalar, Roslina Ismail and Abdul Razak Daud. 2016. Directional Growth Behaviour of Intermetallic Compound of\u00a0\u00a0Sn3.0Ag0.5Cu\/ImSn subjected to Thermal Cycling. Materials Science Forum 857: 36-39.<\/li>\n<\/ol>\n","protected":false},"excerpt":{"rendered":"

    Senior Lecturer \/ Research Fellow Phone: 03-89216984 Email: maria@ukm.edu.my ORCID ID: 0000-0002-9745-3334 Google Scholar Profile SCOPUS Profile   EDUCATIONAL QUALIFICATIONS 2007 Bachelor of Science, 2007, …<\/a><\/p>\n","protected":false},"author":1,"featured_media":0,"parent":111,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-2505","page","type-page","status-publish","hentry"],"aioseo_notices":[],"aioseo_head":"\n\t\t\n\t\n\t\n\t\n\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t