{"id":2111,"date":"2017-05-09T09:00:51","date_gmt":"2017-05-09T09:00:51","guid":{"rendered":"https:\/\/www.ukm.my\/imen\/?page_id=2111"},"modified":"2017-05-09T09:01:48","modified_gmt":"2017-05-09T09:01:48","slug":"roslina-binti-ismail-ph-d","status":"publish","type":"page","link":"https:\/\/www.ukm.my\/imen\/research-fellows\/roslina-binti-ismail-ph-d\/","title":{"rendered":"Dr. Roslina Binti Ismail"},"content":{"rendered":"<p><a href=\"https:\/\/www.ukm.my\/imen\/wp-content\/uploads\/2017\/05\/roslina-2.jpg\"><img fetchpriority=\"high\" decoding=\"async\" class=\"alignnone size-medium wp-image-2114\" src=\"https:\/\/www.ukm.my\/imen\/wp-content\/uploads\/2017\/05\/roslina-2-225x300.jpg\" alt=\"\" width=\"225\" height=\"300\" srcset=\"https:\/\/www.ukm.my\/imen\/wp-content\/uploads\/2017\/05\/roslina-2-225x300.jpg 225w, https:\/\/www.ukm.my\/imen\/wp-content\/uploads\/2017\/05\/roslina-2-768x1024.jpg 768w, https:\/\/www.ukm.my\/imen\/wp-content\/uploads\/2017\/05\/roslina-2.jpg 900w\" sizes=\"(max-width: 225px) 100vw, 225px\" \/><\/a><\/p>\n<p><em>Research Fellow \/ Senior Lecturer<\/em><\/p>\n<p>Phone. +603 89**<br \/>\nE-mail: roslina.ismail@ukm.edu.my<\/p>\n<p>&nbsp;<\/p>\n<p>EDUCATIONS<\/p>\n<ul>\n<li>2015-2017, Masters in Art (Fine Arts; Major: Painting), Universiti Teknologi MARA (2015-2017)<\/li>\n<li>2005-2010, PhD. in Engineering(Advanced Materials and Nanotechnology), University of Malaya<\/li>\n<li>2001-2003, Masters in Engineering Science(Advanced Materials and Engineering), University of Malaya, Malaysia (2001-2003)<\/li>\n<li>1991-1993, Bachelor of Science (Hons.), Chemistry, Major: Technology, University of Manchester, Inst. of Science and technology (UMIST)<\/li>\n<\/ul>\n<p>&nbsp;<\/p>\n<p>RESEARCH INTEREST<\/p>\n<p>Electronic packaging, biomimicry and nanotechnology<\/p>\n<p>&nbsp;<\/p>\n<p>WORK EXPERIENCES<\/p>\n<ul>\n<li>October 2016- now, Research Fellow (Permanent) at Institute of Microelectronics and Nanoengineering (IMEN), Universiti Kebangsaan Malaysia (National University of Malaysia)<\/li>\n<li>2012-2014, Technical Consultant at EFGO Scientific Sdn. Bhd.<br \/>\nKulim HiTech, Kulim Kedah, Malaysia<\/li>\n<li>2010-2012, Senior Lecturer at School of Engineering, Taylor\u2019s University, Malaysia<\/li>\n<li>2004-2005, Lecturer at Dept. of Mechanical Engineering, Universiti Malaya<\/li>\n<li>2001-2004, Tutor and Lab Demonstrator at Dept. of Mechanical Engineering, Universiti Malaya<\/li>\n<li>1994-1998, Lecturer at Faculty of Applied Science, UiTM, Shah Alam<\/li>\n<\/ul>\n<p>&nbsp;<\/p>\n<p>RESEARCH GRANTS<\/p>\n<ul>\n<li>2009-2010 UM Short Term Research Grant \u2013 RM 27,000<\/li>\n<li>2007-2009 Sciencefund, MOSTI \u2013 RM 162,540<\/li>\n<li>2006-2007 FFP Research Grant, UM \u2013 RM 36,000<\/li>\n<li>2005-2007 Sultan Iskandar Johor Foundation \u2013 Tuition Fees +Monthly Stipend<\/li>\n<li>2003-2004 UM Vot F Short Term Research Grant -RM10,000<\/li>\n<li>2002-2003 UM Vot F Short Term Research Grant- RM4,000<\/li>\n<li>2001-2003 Skim Pascasiswazah UM \u2013Tuition fees + Monthly Stipend<br \/>\n1992-1993 MARA Scholarship<\/li>\n<\/ul>\n<p>&nbsp;<\/p>\n<p>PUBLICATIONS<\/p>\n<ol>\n<li>Deformation Behaviour of Sn-3.0Ag-0.5Cu Solder Wire Under Varied\u00a0Tensile Strain Rates Soldering and Surface Mount Technology (In Press)\u00a0SAC-xTiO2 nano-reinforced lead free solder joint characterizations in\u00a0ultra-fine package assembly Materials and Design (In Press)<br \/>\n2016<\/li>\n<li>R Ismail, F Harun, A Jalar, S Abdullah &#8211; Materials Science Forum, 2016,\u00a0Mechanical Interlocking on Leadframe Surface for Bondability of Au Wedge\u00a0Bond.<\/li>\n<li>M Abu Bakar, A Jalar, R Ismail, AR Daud &#8211; Materials Science Forum, 2016,\u00a0Nanoindentation of Sn3. 0Ag0. 5Cu\/ENIG Solder Joint after High Temperature\u00a0Storage.<\/li>\n<li>M Abu Bakar, A Jalar, R Ismail, AR Daud &#8211; Materials Science Forum, 2016,\u00a0Wettability of CNT-doped Solder Under Isothermal Aging.<\/li>\n<li>R Ismail, F\u00a0Harun, A Jalar, S Abdullah &#8211; Materials Science Forum, 2016,\u00a0Ultrasonic Vibration In Leadframe For The Bondability For Au Wedge Bond.<\/li>\n<li>MA Bakar, A Jalar, R Ismail, AR Daud &#8211; Materials Science Forum, 2016,\u00a0Directional Growth Behaviour of Intermetallic Compound of Sn3. 0Ag0.\u00a05Cu\/ImSn subjected to Thermal Cycling.<\/li>\n<li>N Ismail, R Ismail, NKAN Ubaidillah, A Jalar, NM Zain &#8211; Materials\u00a0Science Forum, Surface Roughness and Wettability of SAC\/CNT Lead Free\u00a0Solder.<\/li>\n<li>Ismail, R., Harun, F., Zulkifli, M.N., Jalar, A., Bakar, M.A. &amp; Abdullah, S. 2015. Bondability of Second Copper Wire Bonds on Silver and\u00a0Nickel\u2013Palladium\u2013Gold\u2013Silver Metallization. IEEE Transactions On\u00a0Components, Packaging And Manufacturing Technology, 5(10): 1541-1545.<\/li>\n<li>Ismail, R., Omar, G., Jalar, A. &amp; Majlis, B.Y. 2015. The Influence of\u00a0Pd-Doped Au Wire Bonding on HAZ Microstructure and Looping Profile in\u00a0MicroElectromechanical Systems (MEMS) Packaging. Journal of Electronic\u00a0Materials 44(7): 2507-2513.<\/li>\n<li>Ani, F.C., Jalar, A., Ismail, R., Othman, N.K., Abdullah, M. Z. &amp; Aziz,\u00a0M.S.A. 2015. Reflow Optimization Process: Thermal Stress Using Numerical\u00a0Analysis and Intermetallic Spallation in Backwards Compatibility Solder\u00a0Joints. Arabian Journal for Science and Engineering 40(6): 1669-1679.<\/li>\n<li>Yahya, S. Othman, N.K., Daud, A.R., Jalar, A. &amp; Ismail, R. 2015. The\u00a0influence of temperature on the inhibition of carbon steel corrosion in\u00a0acidic lignin. AntiCorrosion Methods and Materials 62(5): 301-306.<\/li>\n<li>Harun, F., Ismail, R., Jalar, A. &amp; Abdullah, S. 2015. Effect of wire\u00a0diameter and hook location on second bond failure modes. Microelectronics\u00a0International 32(1):32-36.<\/li>\n<li>Yusoff, W.Y.W. Ismail, R., Jalar, A., Othman, N.K. &amp; Rahman, I.A. 2014.\u00a0Microstructural evolution and micromechanical properties of gamma-irradiated Au ball bonds. Materials Characterization 93: 129-135.<\/li>\n<li>S. M. Yusof, J. Jai, M. A. Hashim, R.\u00a0Ismail, A. Hadi, Surface Morphology Study: Effect of Electrolyte pH on the\u00a0Electrodeposited SnAg-Cu (SAC) Solder Alloy&#8221; Applied Mechanics and<br \/>\nMaterials, Vol. 575, pp. 481-485, Jun. 2014,\u00a0DOI: 10.4028\/www.scientific.net\/AMM.575.481 Scopus Indexed; TTP<\/li>\n<\/ol>\n","protected":false},"excerpt":{"rendered":"<p>Research Fellow \/ Senior Lecturer Phone. +603 89** E-mail: roslina.ismail@ukm.edu.my &nbsp; EDUCATIONS 2015-2017, Masters in Art (Fine Arts; Major: Painting), Universiti Teknologi MARA (2015-2017) 2005-2010,<a class=\"ut-readmore\" href=\"https:\/\/www.ukm.my\/imen\/research-fellows\/roslina-binti-ismail-ph-d\/\"> &#8230;<\/a><\/p>\n","protected":false},"author":1,"featured_media":0,"parent":111,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-2111","page","type-page","status-publish","hentry"],"aioseo_notices":[],"aioseo_head":"\n\t\t<!-- All in One SEO 4.9.8 - aioseo.com -->\n\t<meta name=\"description\" content=\"Research Fellow \/ Senior Lecturer Phone. +603 89** E-mail: roslina.ismail@ukm.edu.my EDUCATIONS 2015-2017, Masters in Art (Fine Arts; 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